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 Gaiser® brand precision bonding tools are superior wire bonding tools for the semiconductor and hybrid micro-electronics industries. These tools include capillaries and fine-pitch capillaries for gold and copper ball bonding, small and large wire wedges for gold and aluminum wire, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools, parallel gap electrodes (PGE's), waffle tools for the disk drive industry, specialty nozzles, and a high-precision job shop.
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